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Releases by John H. Lau

Cover for John H. Lau · Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology (Hardcover Book) (2024)

Flip Chip, Hybrid Bonding, Fan-I... (2024)

Cover for John H. Lau · Chiplet Design and Heterogeneous Integration Packaging (Paperback Book) [2023 edition] (2024)

Chiplet Design and Heterogeneous... (2024)

Cover for John H. Lau · Chiplet Design and Heterogeneous Integration Packaging (Hardcover Book) [2023 edition] (2023)

Chiplet Design and Heterogeneous... (2023)

Cover for John H. Lau · Semiconductor Advanced Packaging (Paperback Book) [2021 edition] (2022)

Semiconductor Advanced Packaging (2022)

Cover for John H. Lau · Assembly and Reliability of Lead-Free Solder Joints (Paperback Book) [2020 edition] (2021)

Assembly and Reliability of Lead... (2021)

Cover for John H. Lau · Semiconductor Advanced Packaging (Hardcover Book) [2021 edition] (2021)

Semiconductor Advanced Packaging (2021)

Cover for John H. Lau · Assembly and Reliability of Lead-Free Solder Joints (Hardcover Book) [2020 edition] (2020)

Assembly and Reliability of Lead... (2020)

Cover for John H. Lau · Heterogeneous Integrations (Hardcover Book) [2019 edition] (2019)

Heterogeneous Integrations (2019)

Cover for John H. Lau · Fan-Out Wafer-Level Packaging (Paperback Book) [Softcover Reprint of the Original 1st 2018 edition] (2018)

Softcover Reprint of the Original 1st 2018 edition

Fan-Out Wafer-Level Packaging (2018)

Cover for John H. Lau · Fan-Out Wafer-Level Packaging (Hardcover Book) [2018 edition] (2018)

Fan-Out Wafer-Level Packaging (2018)

Cover for John H. Lau · Solder Joint Reliability: Theory and Applications (Paperback Book) [Softcover reprint of the original 1st ed. 1991 edition] (2014)

Softcover reprint of the original 1st ed. 1991 edition

Solder Joint Reliability: Theory... (2014)

Cover for John H. Lau · Chip on Board: Technology for Multichip Modules (Hardcover Book) (1994)

Chip on Board: Technology for Mu... (1994)

Cover for John H. Lau · Handbook Of Tape Automated Bonding (Hardcover Book) [1992 edition] (1992)

Handbook Of Tape Automated Bonding (1992)

Cover for John H. Lau · Solder Joint Reliability: Theory and Applications (Hardcover Book) [1991 edition] (1991)

Solder Joint Reliability: Theory... (1991)