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Advanced MEMS Packaging John Lau Ed edition
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Advanced MEMS Packaging
John Lau
This book presents the latest and cutting-edge MEMS (Microelectromechanical systems) packaging techniques such as low-temperature bonding and 3D packaging.
576 pages, Illustrations
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | December 16, 2009 |
| ISBN13 | 9780071626231 |
| Publishers | McGraw-Hill Education - Europe |
| Pages | 576 |
| Dimensions | 161 × 237 × 36 mm · 906 g |