In case cover and title do not match, the title is correct

Tell your friends about this item:

Electronics Cooling: From the Chip to the Datacenter - Advances in Heat Transfer

Do you have a profile? Log in

Christmas presents can be returned until 31 January

Our customers say:

Add to your iMusic wish list

Not rated yet

Media	Books Hardcover Book (Book with hard spine and cover)
Released	November 1, 2026
ISBN13	9780443470844
Publishers	Elsevier Science Publishing Co Inc
Pages	300
Dimensions	150 × 220 × 20 mm · 450 g