ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing, Interconnect and Reliability, Fundamen - Asme - Books - American Society of Mechanical Engineers - 9780791856895 - July 30, 2015
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ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing, Interconnect and Reliability, Fundamen

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Presents print proceedings of the ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2015): Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing, Interconnect and Reliability, Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales.

698 pages

Media Books     Paperback Book   (Book with soft cover and glued back)
Released July 30, 2015
ISBN13 9780791856895
Publishers American Society of Mechanical Engineers
Pages 698
Dimensions 150 × 220 × 10 mm   ·   1.04 kg   (Weight (estimated))

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