Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs - Brandon Noia - Books - Springer International Publishing AG - 9783319023779 - December 2, 2013
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Brandon Noia
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs 2014 edition

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This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain.

274 pages, 18 black & white illustrations, 115 colour illustrations, 23 black & white tables, biogra

Media Books     Hardcover Book   (Book with hard spine and cover)
Released December 2, 2013
ISBN13 9783319023779
Publishers Springer International Publishing AG
Pages 245
Dimensions 157 × 243 × 16 mm   ·   657 g
Language German  

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