Materials for Advanced Packaging - - Books - Springer International Publishing AG - 9783319450971 - December 30, 2016
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Materials for Advanced Packaging 2nd ed. 2017 edition

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Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field.

983 pages, 260 black & white illustrations, 440 colour illustrations, 85 black & white tables, 434 c

Media Books     Hardcover Book   (Book with hard spine and cover)
Released December 30, 2016
ISBN13 9783319450971
Publishers Springer International Publishing AG
Pages 969
Dimensions 155 × 235 × 51 mm   ·   1.55 kg
Language French  
Editor Lu, Daniel
Editor Wong, C.P.

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