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Testing of Interposer-Based 2.5D Integrated Circuits Ran Wang Softcover reprint of the original 1st ed. 2017 edition
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Testing of Interposer-Based 2.5D Integrated Circuits
Ran Wang
The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.
182 pages, 50 Tables, color; 102 Illustrations, color; 16 Illustrations, black and white; XIV, 182 p
| Media | Books Paperback Book (Book with soft cover and glued back) |
| Released | May 9, 2018 |
| ISBN13 | 9783319854618 |
| Publishers | Springer International Publishing AG |
| Pages | 182 |
| Dimensions | 150 × 220 × 10 mm · 285 g |
| Language | German |
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