Thermal Imaging in Biosystems Engineering: Principles and Applications - - Books - Springer Verlag, Singapore - 9789819231461 - February 5, 2027
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Thermal Imaging in Biosystems Engineering: Principles and Applications

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Expected delivery Feb 15 - 18, 2027

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This book provides an overview of infrared thermal imaging as an advanced, non-contact, and non-destructive tool in biosystems engineering.

Media Books     Hardcover Book   (Book with hard spine and cover)
To be released February 5, 2027
ISBN13 9789819231461
Publishers Springer Verlag, Singapore
Pages 250
Dimensions 150 × 220 × 20 mm   ·   533 g   (Weight (estimated))
Editor Jayas, Digvir S.
Editor Kheiralipour, Kamran

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